SUNNYVALE, Calif. - Synopsys Inc . (NASDAQ:SNPS) has announced the availability of its AI-driven multi-die reference flow and Synopsys IP for Intel (NASDAQ:INTC) Foundry's embedded multi-die interconnect bridge (EMIB) technology. This development aims to expedite the design and production of heterogeneous multi-die systems, which are increasingly used in AI and high-performance computing applications due to their enhanced processing power and performance.
The newly released multi-die reference flow is powered by Synopsys.ai™ EDA suite and is touted to improve the quality of results for heterogeneous integration. The Synopsys 3DIC Compiler, a significant component of this solution, facilitates the co-design of multi-die systems, supporting efficient die-to-die connectivity and meeting high memory bandwidth demands. Integrated with Ansys (NASDAQ:ANSS)® RedHawk-SC Electrothermal™ multiphysics technology, the 3DIC Compiler also addresses power and thermal signoff, which is critical for 2.5D/3D multi-die designs.
Sanjay Bali, vice president of strategy and product management for the Synopsys EDA Group, emphasized the growing demand for multi-die designs and the importance of the collaboration with Intel Foundry in providing a comprehensive solution for developing complex multi-die systems. Suk Lee, VP & GM of Ecosystem Technology Office at Intel Foundry, highlighted the need for a holistic approach to address the challenges associated with multi-die architectures, such as thermal management, signal integrity, and interconnects.
The collaboration between Intel Foundry and Synopsys aims to offer designers a scalable solution for rapid heterogeneous integration using Intel Foundry's EMIB technology. The combination of Synopsys IP and the 3DIC Compiler has been shown to potentially reduce effort by up to 30% and improve quality of results by 15%, compared to traditional manual flows.
The reference flow is available now through Intel Foundry or Synopsys. This announcement follows a previous collaboration on the Intel 18A process, reinforcing the ongoing partnership between the two companies in advancing chip design technologies.
This news is based on a press release statement from Synopsys, Inc. which outlines the features and benefits of the integrated solution designed to streamline the development of multi-die systems.
InvestingPro Insights
Synopsys Inc. (NASDAQ:SNPS) is at the forefront of technological advancements with its latest AI-driven multi-die reference flow, enhancing the design and production capabilities in the AI and high-performance computing spheres. The financial metrics and market performance of Synopsys further cement its position as a leading force in the industry. With a robust Market Cap of 91.72B USD, Synopsys showcases its significant presence in the market.
The company's dedication to innovation is also reflected in its financial health, highlighted by an impressive Gross Profit Margin of 80.39% for the last twelve months as of Q2 2024. This figure not only demonstrates Synopsys' ability to maintain profitability but also supports its capacity for sustained investment in research and development. Furthermore, the company's Revenue Growth of 25.53% during the same period indicates a strong demand for its products and services, aligning with the increasing need for sophisticated multi-die systems.
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